DICE (WAFER SAWN) - FRAME
Type | Description |
---|---|
Series: | * |
Package: | Tray |
Part Status: | Active |
Type: | - |
Input Type: | - |
Output Type: | - |
Current - Supply: | - |
Operating Temperature: | - |
Mounting Type: | - |
Package / Case: | - |
Supplier Device Package: | - |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
ZSSC3026CI1BRenesas Electronics America |
WAFER (UNSAWN) - BOX |
|
ZSSC3036CC1BRenesas Electronics America |
WAFER (UNSAWN) - BOX |
|
ZSSC3170EE1DRenesas Electronics America |
DICE (WAFER SAWN) - WAFFLE PACK |
|
ZSC31014EABRenesas Electronics America |
WAFER (UNSAWN) - BOX |
|
ZSSC3015NA1CRenesas Electronics America |
DICE (WAFER SAWN) - FRAME |
|
GH65C11-C-SS-1Grayhill, Inc. |
ENDCODER OPTICAL |
|
ZSSC3016CC1CRenesas Electronics America |
DICE (WAFER SAWN) - FRAME |
|
ZSC31010CIBRenesas Electronics America |
WAFER (UNSAWN) - BOX |
|
ZSSC3026CC1BRenesas Electronics America |
WAFER (UNSAWN) - BOX |
|
MAX32664GWEC+TMaxim Integrated |
SENSOR HUB W/ SPO2 & HR ALGORITH |
|
MAX9621AUB/V+Maxim Integrated |
DUAL, 2-WIRE HALL-EFFECT SENSOR |
|
MAX9621AUB/V+TMaxim Integrated |
DUAL, 2-WIRE HALL-EFFECT SENSOR |
|
ZSSC3154BE1DRenesas Electronics America |
DICE (WAFER SAWN) - WAFFLE PACK |