WAFER (UNSAWN) - BOX
Type | Description |
---|---|
Series: | * |
Package: | Tray |
Part Status: | Active |
Type: | - |
Input Type: | - |
Output Type: | - |
Current - Supply: | - |
Operating Temperature: | - |
Mounting Type: | - |
Package / Case: | - |
Supplier Device Package: | - |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
ZSSC3026CC1BRenesas Electronics America |
WAFER (UNSAWN) - BOX |
|
MAX32664GWEC+TMaxim Integrated |
SENSOR HUB W/ SPO2 & HR ALGORITH |
|
MAX9621AUB/V+Maxim Integrated |
DUAL, 2-WIRE HALL-EFFECT SENSOR |
|
MAX9621AUB/V+TMaxim Integrated |
DUAL, 2-WIRE HALL-EFFECT SENSOR |
|
ZSSC3154BE1DRenesas Electronics America |
DICE (WAFER SAWN) - WAFFLE PACK |
|
AD9923BBCZRLRochester Electronics |
DAC, 12-BIT, 1 CHANNEL, PBGA105 |
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ZSSC3218BI2BRenesas Electronics America |
WAFER (UNSAWN) - BOX |
|
AS6500-FQFMScioSense |
AS6500-FQFM QFN40 LF T&RDP |
|
ZSSC4162BE1BRenesas Electronics America |
WAFER (UNSAWN) - BOX |
|
BD9261EFV-E2ROHM Semiconductor |
IC PREAMP HBD PIR SENSOR 14SSOP |
|
ZSSC3016DI1BRenesas Electronics America |
WAFER (UNSAWN) - BOX |
|
ZSSC3123AI3BRenesas Electronics America |
WAFER (UNSAWN) - WAFER BOX |
|
ZSC31010CECRenesas Electronics America |
DICE (WAFER SAWN) - FRAME |