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ZSSC3170EE1D

ZSSC3170EE1D

DICE (WAFER SAWN) - WAFFLE PACK

ZSSC3170EE1D

ZSSC3170EE1D

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Part No :

ZSSC3170EE1D

Manufacturer
Renesas Electronics America
Description
DICE (WAFER SAWN) - WAFFLE PACK
Catalog
Interface - Sensor and Detector Interfaces
Availability
391739 pieces
Shipped from
HK warehouse
Expected Shipping Date
Nov 24 - Nov 28 2024
Type Description
Series:*
Package:Tray
Part Status:Active
Type:-
Input Type:-
Output Type:-
Current - Supply:-
Operating Temperature:-
Mounting Type:-
Package / Case:-
Supplier Device Package:-
ZSSC3170EE1D is available at GangBo-ic.com, Please review product page below for detailed information, including ZSSC3170EE1D price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for ZSSC3170EE1D to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

GANG BO INDUSTRIAL CO., LIMITED [Hongkong]

UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK

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