HEATSINK CPU 21MM SQ W/DBL TAPE
Type | Description |
---|---|
Series: | 624 |
Package: | Bulk |
Part Status: | Obsolete |
Type: | Top Mount |
Package Cooled: | BGA |
Attachment Method: | Thermal Tape, Adhesive (Included) |
Shape: | Square, Pin Fins |
Length: | 0.827" (21.00mm) |
Width: | 0.827" (21.00mm) |
Diameter: | - |
Fin Height: | 0.250" (6.35mm) |
Power Dissipation @ Temperature Rise: | - |
Thermal Resistance @ Forced Air Flow: | 25.00°C/W @ 200 LFM |
Thermal Resistance @ Natural: | - |
Material: | Aluminum |
Material Finish: | Black Anodized |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
658-60ABT4Wakefield-Vette |
HEATSINK CPU 27.9MM SQ W/ADH BLK |
|
HP1-TO3-CBCTS Corporation |
HEATSINK PWR .90"H BLACK TO-3 |
|
821102B00000Comair Rotron |
HEATSINK STAMP 9.5X13.2X19.1MM |
|
821102B04000Comair Rotron |
HEATSINK STAMP 9.5X13.2X19.1MM |
|
HS20Apex Microtechnology |
HEATSINK 10P/12P PWR SIP |
|
TG-CJ-12-12-10-PFt-Global Technology |
HEATSINK CER 12X12X10MM |
|
XL25-15-15-5t-Global Technology |
CERAMIC HEAT SPREADER 15X15MM GR |
|
UP10-TO3-2CBCTS Corporation |
HEATSINK BOARD MNT BLACK TO-3 |
|
821002B04000Comair Rotron |
HEATSINK STAMP 6.4X13.3X19.1MM |
|
342943Aavid |
COPPER HEATSINK 50X50X14MM |
|
APR38-38-12CB/TCTS Corporation |
HEATSINK FORGED WITH TALL CLIP |
|
TXBF032025BCTS Corporation |
THERMAL LINK PRESSON TO-5 |
|
TG-CJ-LI-43-43-6-PFt-Global Technology |
HEATSINK CER 43X43X6MM W/TAPE |