COPPER HEATSINK 50X50X14MM
Type | Description |
---|---|
Series: | - |
Package: | Tray |
Part Status: | Active |
Type: | Top Mount, Skived |
Package Cooled: | BGA |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.969" (50.00mm) |
Width: | 1.969" (50.00mm) |
Diameter: | - |
Fin Height: | 0.551" (14.00mm) |
Power Dissipation @ Temperature Rise: | - |
Thermal Resistance @ Forced Air Flow: | 2.10°C/W @ 200 LFM |
Thermal Resistance @ Natural: | 8.90°C/W |
Material: | Copper |
Material Finish: | AavSHIELD 3C |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
APR38-38-12CB/TCTS Corporation |
HEATSINK FORGED WITH TALL CLIP |
|
TXBF032025BCTS Corporation |
THERMAL LINK PRESSON TO-5 |
|
TG-CJ-LI-43-43-6-PFt-Global Technology |
HEATSINK CER 43X43X6MM W/TAPE |
|
PSE1-2CBCTS Corporation |
HEATSINK DUAL VERT BLACK TO-220 |
|
TXBF-032-025UCTS Corporation |
THERMAL LINK PRESSON TO-5 |
|
PSB2-1NDCTS Corporation |
HEATSINK V/H W/TABS NICKL TO-220 |
|
DV-T268-101EOhmite |
HEATSINK FOR TO-268 |
|
658-25ABT1Wakefield-Vette |
HEATSINK CPU 28MM SQ BLK W/TAPE |
|
PA2-1CBCTS Corporation |
HEATSINK LOW PROFILE BLK TO-220 |
|
658-60ABT1Wakefield-Vette |
HEATSINK CPU 28MM SQ BLK W/TAPE |
|
HS22Apex Microtechnology |
HEATSINK THERMALLOY 6025B |
|
TG-CJ-LI-30.5-30.5-6-PFt-Global Technology |
HEATSINK CER 30.5X30.5X6MM W/TAP |
|
833802T00000Comair Rotron |
HEATSINK STAMP 13.1X13.2X24MM |