HEATSINK CPU 27.9MM SQ W/ADH BLK
Type | Description |
---|---|
Series: | 658 |
Package: | - |
Part Status: | Obsolete |
Type: | Top Mount |
Package Cooled: | BGA |
Attachment Method: | Thermal Tape, Adhesive (Included) |
Shape: | Square, Pin Fins |
Length: | 1.100" (27.94mm) |
Width: | 1.100" (27.94mm) |
Diameter: | - |
Fin Height: | 0.598" (15.20mm) |
Power Dissipation @ Temperature Rise: | 2.5W @ 30°C |
Thermal Resistance @ Forced Air Flow: | 2.00°C/W @ 500 LFM |
Thermal Resistance @ Natural: | - |
Material: | Aluminum |
Material Finish: | Black Anodized |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
![]() |
HP1-TO3-CBCTS Corporation |
HEATSINK PWR .90"H BLACK TO-3 |
![]() |
821102B00000Comair Rotron |
HEATSINK STAMP 9.5X13.2X19.1MM |
![]() |
821102B04000Comair Rotron |
HEATSINK STAMP 9.5X13.2X19.1MM |
![]() |
HS20Apex Microtechnology |
HEATSINK 10P/12P PWR SIP |
![]() |
TG-CJ-12-12-10-PFt-Global Technology |
HEATSINK CER 12X12X10MM |
![]() |
XL25-15-15-5t-Global Technology |
CERAMIC HEAT SPREADER 15X15MM GR |
![]() |
UP10-TO3-2CBCTS Corporation |
HEATSINK BOARD MNT BLACK TO-3 |
![]() |
821002B04000Comair Rotron |
HEATSINK STAMP 6.4X13.3X19.1MM |
![]() |
342943Aavid |
COPPER HEATSINK 50X50X14MM |
![]() |
APR38-38-12CB/TCTS Corporation |
HEATSINK FORGED WITH TALL CLIP |
![]() |
TXBF032025BCTS Corporation |
THERMAL LINK PRESSON TO-5 |
![]() |
TG-CJ-LI-43-43-6-PFt-Global Technology |
HEATSINK CER 43X43X6MM W/TAPE |
![]() |
PSE1-2CBCTS Corporation |
HEATSINK DUAL VERT BLACK TO-220 |