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NCSWLF.031 0.5OZ

NCSWLF.031 0.5OZ

LF SOLDER WIRE MINI POCKET PACK

NCSWLF.031 0.5OZ

NCSWLF.031 0.5OZ

Image is for reference, please contact us to get the real picture

Part No :

NCSWLF.031 0.5OZ

Manufacturer
Chip Quik, Inc.
Description
LF SOLDER WIRE MINI POCKET PACK
Catalog
Solder
Availability
10989 pieces
Shipped from
HK warehouse
Expected Shipping Date
Dec 27 - Dec 31 2024
Type Description
Series:-
Package:Bulk
Part Status:Active
Type:Wire Solder
Composition:Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter:0.031" (0.79mm)
Melting Point:423 ~ 428°F (217 ~ 220°C)
Flux Type:No-Clean
Wire Gauge:20 AWG, 21 SWG
Process:-
Form:Tube, 0.50 oz (14.17g)
Shelf Life:-
Shelf Life Start:-
Storage/Refrigeration Temperature:-
NCSWLF.031 0.5OZ is available at GangBo-ic.com, Please review product page below for detailed information, including NCSWLF.031 0.5OZ price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for NCSWLF.031 0.5OZ to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

GANG BO INDUSTRIAL CO., LIMITED [Hongkong]

UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK

Office Hours : Mon-Fri, 9:00-18:30(GMT+8)

[email protected]

Phone: 00852-52612101

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