SOLDER PASTE LOW TEMP T4 10CC
Type | Description |
---|---|
Series: | - |
Package: | Syringe |
Part Status: | Active |
Type: | Solder Paste |
Composition: | Bi57.6Sn42Ag0.4 (57.6/42/0.4) |
Diameter: | - |
Melting Point: | 281°F (138°C) |
Flux Type: | No-Clean |
Wire Gauge: | - |
Process: | Lead Free |
Form: | Syringe, 1.23 oz (35g), 10cc |
Shelf Life: | 6 Months |
Shelf Life Start: | Date of Manufacture |
Storage/Refrigeration Temperature: | 37°F ~ 46°F (3°C ~ 8°C) |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
91-6337-9703Kester |
SOLDER FLUX-CORED/285 63/37 .015 |
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SMD2SW.020 1OZChip Quik, Inc. |
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92-7068-8840Kester |
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24-6337-9710Kester |
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4887-227GMG Chemicals |
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|
24-9574-7611Kester |
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|
SMD291SNLT6Chip Quik, Inc. |
SOLDER PASTE NO CLEAN LEAD-FREE |
|
24-6040-0018Kester |
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|
NC191LT35Chip Quik, Inc. |
SMOOTH FLOW LOW TEMP SOLDER PAST |
|
386876LOCTITE / Henkel |
63/37 400 2% .024DIA 22AWG |
|
96-7069-9520Kester |
SN96.5AG3.0CU0.5 3.3%/268 .020 5 |