LEAD FREE NO-CLEAN FLUX CORE SIL
Type | Description |
---|---|
Series: | - |
Package: | Spool |
Part Status: | Active |
Type: | Wire Solder |
Composition: | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter: | 0.031" (0.79mm) |
Melting Point: | 430°F (221°C) |
Flux Type: | No-Clean |
Wire Gauge: | 20 AWG, 21 SWG |
Process: | Lead Free |
Form: | Spool, 4 oz (113.40g) |
Shelf Life: | - |
Shelf Life Start: | - |
Storage/Refrigeration Temperature: | - |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
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