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3404.2304.11

FUSE BOARD MNT 100MA 125VAC/VDC

SMD291SNL60T4

SMD291SNL60T4

SN96.5/AG3.0/CU0.5 2-PRT MIX 60G

SMD291SNL60T4

SMD291SNL60T4

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Part No :

SMD291SNL60T4

Manufacturer
Chip Quik, Inc.
Description
SN96.5/AG3.0/CU0.5 2-PRT MIX 60G
Catalog
Solder
Availability
167116 pieces
Shipped from
HK warehouse
Expected Shipping Date
Nov 14 - Nov 18 2024
PDF
SMD291SNL60T4 PDF
Type Description
Series:-
Package:Jar
Part Status:Active
Type:Solder Paste, Two Part Mix
Composition:Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter:-
Melting Point:423 ~ 428°F (217 ~ 220°C)
Flux Type:No-Clean
Wire Gauge:-
Process:Lead Free
Form:Jar, 2.12 oz (60g)
Shelf Life:24 Months
Shelf Life Start:Date of Manufacture
Storage/Refrigeration Temperature:37°F ~ 77°F (3°C ~ 25°C)
SMD291SNL60T4 is available at GangBo-ic.com, Please review product page below for detailed information, including SMD291SNL60T4 price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for SMD291SNL60T4 to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

GANG BO INDUSTRIAL CO., LIMITED [Hongkong]

UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK

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