MINI SOIC-10 EXP PAD TO DIP-10 S
Type | Description |
---|---|
Series: | Proto-Advantage |
Package: | Bulk |
Part Status: | Active |
Proto Board Type: | SMD to DIP |
Package Accepted: | MiniSOIC EP |
Number of Positions: | 10 |
Pitch: | 0.020" (0.50mm) |
Board Thickness: | 0.062" (1.57mm) 1/16" |
Material: | FR4 Epoxy Glass |
Size / Dimension: | 0.700" x 0.500" (17.78mm x 12.70mm) |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
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