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PA0368.125NLT

PA0368.125NLT

CURR SENSE XFMR 1:125 SMD

DIP600T300P24

DIP600T300P24

DIP-24 (0.6" BODY) TO DIP-24 (0.

DIP600T300P24

DIP600T300P24

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Part No :

DIP600T300P24

Manufacturer
Chip Quik, Inc.
Description
DIP-24 (0.6" BODY) TO DIP-24 (0.
Catalog
Adapter, Breakout Boards
Availability
659365 pieces
Shipped from
HK warehouse
Expected Shipping Date
Nov 23 - Nov 27 2024
Type Description
Series:Proto-Advantage
Package:Bulk
Part Status:Active
Proto Board Type:DIP to DIP
Package Accepted:-
Number of Positions:24
Pitch:0.100" (2.54mm)
Board Thickness:0.063" (1.60mm)
Material:FR4 Epoxy Glass
Size / Dimension:1.200" L x 0.700" W (30.48mm x 17.78mm)
DIP600T300P24 is available at GangBo-ic.com, Please review product page below for detailed information, including DIP600T300P24 price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for DIP600T300P24 to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

GANG BO INDUSTRIAL CO., LIMITED [Hongkong]

UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK

Office Hours : Mon-Fri, 9:00-18:30(GMT+8)

[email protected]

Phone: 00852-52612101

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