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TW-T400-01-05

TW-T400-01-05

THERMAL INTERFACE MATERIAL

PR55-21A_MEGA

PR55-21A_MEGA

WIRELESS MEGA MODEM

TW-T400-01-05

TW-T400-01-05

Image is for reference, please contact us to get the real picture

Part No :

TW-T400-01-05

Manufacturer
3G Shielding Specialties
Description
THERMAL INTERFACE MATERIAL
Catalog
Thermal - Pads, Sheets
Availability
871087 pieces
Shipped from
HK warehouse
Expected Shipping Date
Nov 23 - Nov 27 2024
Type Description
Series:-
Package:Sheet
Part Status:Active
Usage:Multi
Type:Gap Filler Pad, Sheet
Shape:-
Outline:-
Thickness:0.0197" (0.500mm)
Material:Silicone Elastomer
Adhesive:-
Backing, Carrier:-
Color:Red
Thermal Resistivity:-
Thermal Conductivity:4.0W/m-K
TW-T400-01-05 is available at GangBo-ic.com, Please review product page below for detailed information, including TW-T400-01-05 price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for TW-T400-01-05 to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

GANG BO INDUSTRIAL CO., LIMITED [Hongkong]

UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK

Office Hours : Mon-Fri, 9:00-18:30(GMT+8)

[email protected]

Phone: 00852-52612101

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