THERM PAD 228.6MMX228.6MM PINK
PCI BUS CONTROLLER, CMOS, PBGA25
Type | Description |
---|---|
Series: | Tflex™ SF600 |
Package: | Bulk |
Part Status: | Active |
Usage: | - |
Type: | Gap Filler Pad, Sheet |
Shape: | Rectangular |
Outline: | 228.60mm x 228.60mm |
Thickness: | 0.100" (2.54mm) |
Material: | Non-Silicone, Boron Nitride Filled |
Adhesive: | - |
Backing, Carrier: | - |
Color: | Pink |
Thermal Resistivity: | - |
Thermal Conductivity: | 3.0W/m-K |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
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