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TG994-288-192-3.0

TG994-288-192-3.0

HIGH PERFORMANCE SILICONE GAP FI

TG994-288-192-3.0

TG994-288-192-3.0

Image is for reference, please contact us to get the real picture

Part No :

TG994-288-192-3.0

Manufacturer
t-Global Technology
Description
HIGH PERFORMANCE SILICONE GAP FI
Catalog
Thermal - Pads, Sheets
Availability
560656 pieces
Shipped from
HK warehouse
Expected Shipping Date
Nov 23 - Nov 27 2024
Type Description
Series:TG994
Package:Bulk
Part Status:Obsolete
Usage:-
Type:Conductive Pad, Sheet
Shape:Rectangular
Outline:288.00mm x 192.00mm
Thickness:0.118" (3.00mm)
Material:Silicone
Adhesive:Tacky - Both Sides
Backing, Carrier:-
Color:Gray
Thermal Resistivity:-
Thermal Conductivity:13W/m-K
TG994-288-192-3.0 is available at GangBo-ic.com, Please review product page below for detailed information, including TG994-288-192-3.0 price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for TG994-288-192-3.0 to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

GANG BO INDUSTRIAL CO., LIMITED [Hongkong]

UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK

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Phone: 00852-52612101

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