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BS75K-160-160-2.0

BS75K-160-160-2.0

THERMAL PAD, SHEET 160X160MM, TH

AF256CFI-OEM

AF256CFI-OEM

MEM CARD COMPACTFLASH 256MB SLC

BS75K-160-160-2.0

BS75K-160-160-2.0

Image is for reference, please contact us to get the real picture

Part No :

BS75K-160-160-2.0

Manufacturer
Description
THERMAL PAD, SHEET 160X160MM, TH
Catalog
Thermal - Pads, Sheets
Availability
620662 pieces
Shipped from
HK warehouse
Expected Shipping Date
Nov 23 - Nov 27 2024
Type Description
Series:BS75K
Package:Bag
Part Status:Active
Usage:Multi
Type:Gap Filler Pad, Sheet
Shape:Square
Outline:160.00mm x 160.00mm
Thickness:0.0790" (2.000mm)
Material:Silicone
Adhesive:Tacky - Both Sides
Backing, Carrier:-
Color:Gray
Thermal Resistivity:-
Thermal Conductivity:3.0W/m-K
BS75K-160-160-2.0 is available at GangBo-ic.com, Please review product page below for detailed information, including BS75K-160-160-2.0 price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for BS75K-160-160-2.0 to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

GANG BO INDUSTRIAL CO., LIMITED [Hongkong]

UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK

Office Hours : Mon-Fri, 9:00-18:30(GMT+8)

[email protected]

Phone: 00852-52612101

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  • BS75K-160-160-2.0 Price
  • BS75K-160-160-2.0 Series
  • BS75K-160-160-2.0 Datasheet
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