BOARD LEVEL HEAT SINK
CONN BACK-NUT COLLET SILVER
Type | Description |
---|---|
Series: | - |
Package: | Bulk |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | TO-5 |
Attachment Method: | Bolt On |
Shape: | Cylindrical |
Length: | - |
Width: | - |
Diameter: | 0.318" (8.07mm) ID, 0.602" (15.29mm) OD |
Fin Height: | 0.250" (6.35mm) |
Power Dissipation @ Temperature Rise: | 1.6W @ 80°C |
Thermal Resistance @ Forced Air Flow: | 30.00°C/W @ 200 LFM |
Thermal Resistance @ Natural: | - |
Material: | Aluminum |
Material Finish: | Red Anodized |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
642-35ABT5Wakefield-Vette |
HEATSINK FOR 35MM BGA |
|
ATS-13F-94-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
|
652503B02500,MODG (065365)Aavid |
HEATSINK |
|
ATS-14D-94-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
|
ATS-08H-156-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
|
ATS-14A-64-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
|
642-45ABT3Wakefield-Vette |
HEATSINK FOR 35MM BGA |
|
ATS-02H-156-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
|
ATS-EXL119-1220-R0Advanced Thermal Solutions, Inc. |
PCIE EXTRUSION PROFILE, AL6063 |
|
625-60ABT4EWakefield-Vette |
HEATSINK FOR 25MM BGA |
|
ATS-06F-156-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
|
7121DGAavid |
BOARD LEVEL HEAT SINK |
|
ATS-EXL67-1220-R0Advanced Thermal Solutions, Inc. |
HEATSINK AL6063 1220X27.5X13.5MM |