HEATSINK
Type | Description |
---|---|
Series: | - |
Package: | Bulk |
Part Status: | Active |
Type: | - |
Package Cooled: | - |
Attachment Method: | - |
Shape: | - |
Length: | - |
Width: | - |
Diameter: | - |
Fin Height: | - |
Power Dissipation @ Temperature Rise: | - |
Thermal Resistance @ Forced Air Flow: | - |
Thermal Resistance @ Natural: | - |
Material: | - |
Material Finish: | - |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
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ATS-14D-94-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
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ATS-08H-156-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
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ATS-14A-64-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
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642-45ABT3Wakefield-Vette |
HEATSINK FOR 35MM BGA |
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ATS-02H-156-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
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ATS-EXL119-1220-R0Advanced Thermal Solutions, Inc. |
PCIE EXTRUSION PROFILE, AL6063 |
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625-60ABT4EWakefield-Vette |
HEATSINK FOR 25MM BGA |
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ATS-06F-156-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
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7121DGAavid |
BOARD LEVEL HEAT SINK |
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ATS-EXL67-1220-R0Advanced Thermal Solutions, Inc. |
HEATSINK AL6063 1220X27.5X13.5MM |
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B60-075-VEOhmite |
HEATSINK FOR TO-247 TO-264 |
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630-25ABWakefield-Vette |
HEATSINK FOR 35MM BGA |
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PH3N-100-100-0.07-1At-Global Technology |
PH3N 100X100X0.07MM W/ADH |