BOM, ASSEMBLY, 4623 XF PUSH PI
Type | Description |
---|---|
Series: | * |
Package: | Bulk |
Part Status: | Active |
Type: | - |
Package Cooled: | - |
Attachment Method: | - |
Shape: | - |
Length: | - |
Width: | - |
Diameter: | - |
Fin Height: | - |
Power Dissipation @ Temperature Rise: | - |
Thermal Resistance @ Forced Air Flow: | - |
Thermal Resistance @ Natural: | - |
Material: | - |
Material Finish: | - |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
6400B-P2GAavid |
BOARD LEVEL HEAT SINK |
|
ATS-52170G-C0-R0Advanced Thermal Solutions, Inc. |
HEATSINK 17X17X12.5MM W/OUT TIM |
|
286-CTEWakefield-Vette |
HEATSINK FOR TO220 |
|
ATS-EXL104-1220-R0Advanced Thermal Solutions, Inc. |
HEATSINK AL6063 1220X108X34.3MM |
|
TGH-0450-01t-Global Technology |
ALUMINIUM HEAT SINK 45X45MM |
|
ATS-21G-64-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
|
2286BGAavid |
HEATSINK |
|
ATS-09D-94-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
|
125545Wakefield-Vette |
7WX36" EXTRUSION 16235 XX5733 |
|
HSET860-BGA-1iBASE Technology |
HEATSINK FOR ET860(H051HSET860B0 |
|
ATS-11H-05-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM XCUT T766 |
|
ATS-09C-94-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
|
133-5G9Wakefield-Vette |
HEATSINK EXTRUDED |