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HSET860-BGA-1

HSET860-BGA-1

HEATSINK FOR ET860(H051HSET860B0

HSET860-BGA-1

HSET860-BGA-1

Image is for reference, please contact us to get the real picture

Part No :

HSET860-BGA-1

Manufacturer
iBASE Technology
Description
HEATSINK FOR ET860(H051HSET860B0
Catalog
Thermal - Heat Sinks
Availability
835083 pieces
Shipped from
HK warehouse
Expected Shipping Date
Aug 24 - Aug 28 2025
Type Description
Series:-
Package:Box
Part Status:Active
Type:Top Mount
Package Cooled:ET860
Attachment Method:-
Shape:-
Length:-
Width:-
Diameter:-
Fin Height:-
Power Dissipation @ Temperature Rise:-
Thermal Resistance @ Forced Air Flow:-
Thermal Resistance @ Natural:-
Material:-
Material Finish:-
HSET860-BGA-1 is available at GangBo-ic.com, Please review product page below for detailed information, including HSET860-BGA-1 price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for HSET860-BGA-1 to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

GANG BO INDUSTRIAL CO., LIMITED [Hongkong]

UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK

Office Hours : Mon-Fri, 9:00-18:30(GMT+8)

[email protected]

Phone: 00852-52612101

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