BOARD LEVEL HEAT SINK
Type | Description |
---|---|
Series: | - |
Package: | Bulk |
Part Status: | Active |
Type: | Board Level |
Package Cooled: | Multiwatt, SIP |
Attachment Method: | Clip |
Shape: | Rectangular, Fins |
Length: | 0.620" (15.75mm) |
Width: | 0.845" (21.46mm) |
Diameter: | - |
Fin Height: | 0.380" (9.65mm) |
Power Dissipation @ Temperature Rise: | 2.0W @ 50°C |
Thermal Resistance @ Forced Air Flow: | 6.00°C/W @ 400 LFM |
Thermal Resistance @ Natural: | 20.60°C/W |
Material: | Aluminum |
Material Finish: | Black Anodized |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
ATS-12D-05-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM XCUT T766 |
|
ATS-55190R-C0-R0Advanced Thermal Solutions, Inc. |
HEATSINK 19X19X19.5MM W/OUT TIM |
|
ATS-17A-94-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
|
518-95AB-MEWakefield-Vette |
HEATSINK DC/DC HALF BRICK VERT |
|
254-195ABPEWakefield-Vette |
HEATSINK TO PKG FOLDED FIN |
|
ATS-20A-156-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
|
ATS-21F-184-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
|
ATS-15C-64-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
|
ATS-02C-94-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
|
909-37-1-15-2-B-0Wakefield-Vette |
HEAT SINK ELLIP FIN 37X37MM CLIP |
|
HSIBQ800-AiBASE Technology |
HEAT SINK FOR IBQ800 (H052HSIBQ8 |
|
630-35ABT5Wakefield-Vette |
HEATSINK FOR 35MM BGA |
|
40482Vicor |
BOM ASSY 4623 XF PUSH PIN HTSN |