HEATSINK FOR 35MM BGA
Type | Description |
---|---|
Series: | 630 |
Package: | Bulk |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | BGA |
Attachment Method: | Thermal Tape, Adhesive (Not Included) |
Shape: | Square, Pin Fins |
Length: | 1.378" (35.00mm) |
Width: | 1.378" (35.00mm) |
Diameter: | - |
Fin Height: | 0.350" (8.89mm) |
Power Dissipation @ Temperature Rise: | - |
Thermal Resistance @ Forced Air Flow: | 5.00°C/W @ 500 LFM |
Thermal Resistance @ Natural: | - |
Material: | Aluminum |
Material Finish: | Black Anodized |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
40482Vicor |
BOM ASSY 4623 XF PUSH PIN HTSN |
|
532602B00000Aavid |
BOARD LEVEL HEAT SINK |
|
902-21-1-18-2-B-0Wakefield-Vette |
HEAT SINK ELLIP FIN 21X21MM CLIP |
|
905-29-1-23-2-B-0Wakefield-Vette |
HEAT SINK ELLIP FIN 29X29MM CLIP |
|
ATS-13F-184-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
|
547-95ABWakefield-Vette |
HEATSINK DC/DC QUARTER BRICK |
|
ATS-04E-184-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
|
552703B00000Aavid |
BOARD LEVEL HEAT SINK |
|
HSIB908-BGA-1iBASE Technology |
AC, HEATSINK FOR IB908 ONLY , (R |
|
ATS-09G-184-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
|
ATS-03G-184-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
|
655-26ABT5Wakefield-Vette |
HEATSINK FOR 40MM BGA |
|
0372504040Woodhead - Molex |
CHIPSET COOLER CU #1 6500 RPM |