HEATSINK 40X40X25MM R-TAB T766
Type | Description |
---|---|
Series: | pushPIN™ |
Package: | Tray |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.575" (40.00mm) |
Width: | 1.575" (40.00mm) |
Diameter: | - |
Fin Height: | 0.984" (25.00mm) |
Power Dissipation @ Temperature Rise: | - |
Thermal Resistance @ Forced Air Flow: | 9.39°C/W @ 100 LFM |
Thermal Resistance @ Natural: | - |
Material: | Aluminum |
Material Finish: | Blue Anodized |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
![]() |
ATS-55230R-C0-R0Advanced Thermal Solutions, Inc. |
HEATSINK 23X23X19.5MM W/OUT TIM |
![]() |
2292BGAavid |
BOARD LEVEL HEAT SINK |
![]() |
ATS-17D-05-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM XCUT T766 |
![]() |
HSIB919-AiBASE Technology |
AC, HEATSINK FOR IB919 SERIES, ( |
![]() |
ATS-20E-94-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
![]() |
3-1542003-4TE Connectivity AMP Connectors |
35MM HS ASSY ULTEM CL |
![]() |
552844B00000GAavid |
HEATSINK |
![]() |
ATS-07C-156-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
![]() |
ATS-X51330K-C1-R0Advanced Thermal Solutions, Inc. |
MAXIFLOW 32.25X32.25X14.5MM T766 |
![]() |
HSET870-1iBASE Technology |
HEAT SPREADER FOR ET870 (H051HSE |
![]() |
533702B02552GAavid |
BOARD LEVEL HEAT SINK |
![]() |
566902B04000GAavid |
BOARD LEVEL HEAT SINK |
![]() |
655-53ABT5Wakefield-Vette |
HEATSINK FOR 40MM BGA |