Type | Description |
---|---|
Series: | - |
Package: | Bulk |
Part Status: | Active |
Type: | Board Level |
Package Cooled: | BGA |
Attachment Method: | Thermal Tape, Adhesive (Not Included) |
Shape: | Cylindrical |
Length: | - |
Width: | - |
Diameter: | 0.300" (7.62mm) ID, 1.125" (28.57mm) OD |
Fin Height: | - |
Power Dissipation @ Temperature Rise: | 1.5W @ 40°C |
Thermal Resistance @ Forced Air Flow: | 8.00°C/W @ 400 LFM |
Thermal Resistance @ Natural: | - |
Material: | Aluminum |
Material Finish: | Black Anodized |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
ATS-17D-05-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM XCUT T766 |
|
HSIB919-AiBASE Technology |
AC, HEATSINK FOR IB919 SERIES, ( |
|
ATS-20E-94-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
|
3-1542003-4TE Connectivity AMP Connectors |
35MM HS ASSY ULTEM CL |
|
552844B00000GAavid |
HEATSINK |
|
ATS-07C-156-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
|
ATS-X51330K-C1-R0Advanced Thermal Solutions, Inc. |
MAXIFLOW 32.25X32.25X14.5MM T766 |
|
HSET870-1iBASE Technology |
HEAT SPREADER FOR ET870 (H051HSE |
|
533702B02552GAavid |
BOARD LEVEL HEAT SINK |
|
566902B04000GAavid |
BOARD LEVEL HEAT SINK |
|
655-53ABT5Wakefield-Vette |
HEATSINK FOR 40MM BGA |
|
527-24AB-T725Wakefield-Vette |
HEATSINK DC/DC HALF BRICK VERT |
|
ATS-54330K-C0-R0Advanced Thermal Solutions, Inc. |
HEATSINK 33X33X14.5MM W/OUT TIM |