3MIC 3M662XW DLF 3MIL TH 4.25 IN
LAPPING FILM DIAMOND 3U 4.25"
Type | Description |
---|---|
Series: | 662XW |
Package: | Bulk |
Part Status: | Active |
Type: | Lapping Film |
Abrasive Material: | Diamond |
Abrasive Grade: | - |
Abrasive Grit: | - |
Micron Size: | 3µ |
Color: | Pink |
Width: | - |
Length: | - |
Diameter: | 4.25" (107.95mm) |
Applications: | Fiber Optic Connector Polishing |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
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