THERMALLY STABLE SOLDER PASTE NO
Type | Description |
---|---|
Series: | - |
Package: | Bulk |
Part Status: | Active |
Type: | Solder Paste |
Composition: | Bi57.6Sn42Ag0.4 (57.6/42/0.4) |
Diameter: | - |
Melting Point: | 281°F (138°C) |
Flux Type: | No-Clean |
Wire Gauge: | - |
Process: | Lead Free |
Form: | Syringe, 0.53 oz (15g), 5cc |
Shelf Life: | 12 Months |
Shelf Life Start: | Date of Manufacture |
Storage/Refrigeration Temperature: | 68°F ~ 77°F (20°C ~ 25°C) |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
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