L2 BOARD, XHP70.2, LINEAR, 1X4,
SOLDER FLUX-CORED/275 .024" 500G
CONN FMALE INSERT 19P SOLDER CUP
SOLIDMATRIX SURFACE MOUNT FUSES,
Type | Description |
---|---|
Series: | 275 |
Package: | Bulk |
Part Status: | Active |
Type: | Wire Solder |
Composition: | Sn99.3Cu0.7 (99.3/0.7) |
Diameter: | 0.040" (1.02mm) |
Melting Point: | 441°F (227°C) |
Flux Type: | No-Clean |
Wire Gauge: | 18 AWG, 19 SWG |
Process: | Lead Free |
Form: | Spool, 17.64 oz (500g) |
Shelf Life: | - |
Shelf Life Start: | - |
Storage/Refrigeration Temperature: | 50°F ~ 104°F (10°C ~ 40°C) |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
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