SOLDER 500G JAR,SN96.5 AG3.0
Type | Description |
---|---|
Series: | R520A |
Package: | Jar |
Part Status: | Active |
Type: | Solder Paste |
Composition: | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter: | - |
Melting Point: | 423 ~ 424°F (217 ~ 218°C) |
Flux Type: | Water Soluble |
Wire Gauge: | - |
Process: | Lead Free |
Form: | Jar, 17.64 oz (500g) |
Shelf Life: | 4 Months |
Shelf Life Start: | Date of Manufacture |
Storage/Refrigeration Temperature: | 32°F ~ 50°F (0°C ~ 10°C) |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
RASWLF.031 4OZChip Quik, Inc. |
LF SOLDER WIRE 96.5/3/0.5 TIN/SI |
|
SMD2SW.031 2OZChip Quik, Inc. |
SOLDER WIRE 60/40 TIN/LEAD NO-CL |
|
26-5050-0061Kester |
SOLDER FLUX-CORED/44 .062" 5LB S |
|
SMD2SW.031 1LBChip Quik, Inc. |
SOLDER WIRE 60/40 TIN/LEAD NO-CL |
|
24-7080-9715Kester |
SOLDER FLUX-CORED/285 .050 1LB S |
|
24-6040-0007Kester |
SOLDER FLUX-CORED/44 .015" 1LB S |
|
SSWS-T5-15GSRA Soldering Products |
SOLDER PASTE WATER SOLUBLE 63/37 |
|
673828LOCTITE / Henkel |
97SC 400 2% .022DIA 23AWG |
|
70-4825-0904Kester |
NP560 SN96.5AG3.0CU0.5 T4 100 GM |
|
24-6040-9702Kester |
SOLDER FLUX-CORED/285 .020 1LB S |
|
NC191LT15T5Chip Quik, Inc. |
SMOOTH FLOW LOW TEMP SOLDER PAST |
|
14-7068-0125Kester |
SOLDER SOLID WIRE .125" 1LB SPL |
|
SMDIN100-S-1Chip Quik, Inc. |
SOLDER SHOT IN100 1OZ 28G |