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BGA0034-S

BGA0034-S

BGA-676 (1.0 MM PITCH, 26 X 26 G

BGA0034-S

BGA0034-S

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Part No :

BGA0034-S

Manufacturer
Chip Quik, Inc.
Description
BGA-676 (1.0 MM PITCH, 26 X 26 G
Catalog
Solder Stencils, Templates
Availability
240624 pieces
Shipped from
HK warehouse
Expected Shipping Date
Jan 31 - Feb 04 2025
Type Description
Series:Proto-Advantage BGA
Package:Bulk
Part Status:Active
Type:BGA
Number of Positions:676
Pitch:0.039" (1.00mm)
Outer Dimension:2.600" L x 1.800" W (66.04mm x 45.72mm)
Inner Dimension:1.024" L x 1.024" W (26.00mm x 26.00mm)
Thermal Center Pad:-
Material:Stainless Steel
BGA0034-S is available at GangBo-ic.com, Please review product page below for detailed information, including BGA0034-S price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for BGA0034-S to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

GANG BO INDUSTRIAL CO., LIMITED [Hongkong]

UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK

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