10PC DISCRETE 0805 TO 300MIL TH
Type | Description |
---|---|
Series: | Proto-Advantage |
Package: | Bulk |
Part Status: | Active |
Proto Board Type: | SMD to DIP |
Package Accepted: | 0805 |
Number of Positions: | 2 |
Pitch: | - |
Board Thickness: | 0.031" (0.79mm) 1/32" |
Material: | FR4 Epoxy Glass |
Size / Dimension: | 0.400" x 0.100" (10.16mm x 2.54mm) |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
IPC0157Chip Quik, Inc. |
DFN-10 TO DIP-14 SMT ADAPTER (0. |
|
PA0031Chip Quik, Inc. |
QSOP-28 TO DIP-28 SMT ADAPTER |
|
8100-SMT4Twin Industries |
ADAPTER BOARD SMT SOIC MED/WIDE |
|
GSPA-K1Global Specialties |
SMT KIT 6 BOARDS |
|
319010053Seeed |
QFP SURFACE MOUNT PROTOBOARD 0.6 |
|
319010042Seeed |
QFP SURFACE MOUNT PROTOBOARD 0.8 |
|
319010351Seeed |
XQFP BREAKOUT BOARD 0.8MM |
|
319010047Seeed |
QFP SURFACE MOUNT PROTOBOARD 0.5 |
|
2947187Phoenix Contact |
PCB FOR ASSEMBLE ELECT COMPONENT |
|
2947394Phoenix Contact |
PCB FOR ASSEMBLE ELECT COMPONENT |
|
BOB-00494SparkFun |
SOIC TO DIP ADAPTER - 8-PIN |
|
319010045Seeed |
XQFP BREAKOUT BOARD 0.65MM |
|
319010352Seeed |
XQFP BREAKOUT BOARD 0.5MM |