Type | Description |
---|---|
Series: | - |
Package: | Bag |
Part Status: | Active |
Proto Board Type: | SMD to DIP |
Package Accepted: | SOIC, SOP, SSOP |
Number of Positions: | 18 |
Pitch: | 0.100" (2.54mm) |
Board Thickness: | 0.063" (1.60mm) |
Material: | FR4 Epoxy Glass |
Size / Dimension: | 0.905" L x 0.744" W (23.00mm x 18.90mm) |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
EVM-LEADED1Texas Instruments |
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