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MT29F256G08EBCAGB16A3WC1-M

MT29F256G08EBCAGB16A3WC1-M

TLC 256G DIE 32GX8

MT29F256G08EBCAGB16A3WC1-M

MT29F256G08EBCAGB16A3WC1-M

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Part No :

MT29F256G08EBCAGB16A3WC1-M

Manufacturer
Micron Technology
Description
TLC 256G DIE 32GX8
Catalog
Memory
Availability
633163 pieces
Shipped from
HK warehouse
Expected Shipping Date
Nov 15 - Nov 19 2024
Type Description
Series:-
Package:Bulk
Part Status:Active
Memory Type:Non-Volatile
Memory Format:FLASH
Technology:FLASH - NAND (TLC)
Memory Size:256Gb (32G x 8)
Memory Interface:Parallel
Clock Frequency:333 MHz
Write Cycle Time - Word, Page:-
Access Time:-
Voltage - Supply:2.7V ~ 3.6V
Operating Temperature:0°C ~ 70°C (TA)
Mounting Type:Surface Mount
Package / Case:Die
Supplier Device Package:Die
MT29F256G08EBCAGB16A3WC1-M is available at GangBo-ic.com, Please review product page below for detailed information, including MT29F256G08EBCAGB16A3WC1-M price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for MT29F256G08EBCAGB16A3WC1-M to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

GANG BO INDUSTRIAL CO., LIMITED [Hongkong]

UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK

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