IC TELECOM INTERFACE 676TEPBGA
Type | Description |
---|---|
Series: | - |
Package: | Tray |
Part Status: | Active |
Function: | TDM-over-Packet (TDMoP) |
Interface: | TDMoP |
Number of Circuits: | 1 |
Voltage - Supply: | 1.8V, 3.3V |
Current - Supply: | - |
Power (Watts): | - |
Operating Temperature: | -40°C ~ 85°C |
Mounting Type: | Surface Mount |
Package / Case: | 676-BGA |
Supplier Device Package: | 676-TEPBGA (27x27) |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
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