DICE (WAFER SAWN) - WAFFLE PACK
Type | Description |
---|---|
Series: | * |
Package: | Tray |
Part Status: | Active |
Type: | - |
Input Type: | - |
Output Type: | - |
Current - Supply: | - |
Operating Temperature: | - |
Mounting Type: | - |
Package / Case: | - |
Supplier Device Package: | - |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
ZSSC4151AE1CRenesas Electronics America |
DICE (WAFER SAWN) - FRAME |
|
ZSC31050FEDRenesas Electronics America |
DICE (WAFER SAWN) - WAFFLE PACK |
|
MLX75123SLA-ABA-000-REMelexis |
TOF COMPANION CHIP |
|
ZSSC3122AI1BRenesas Electronics America |
WAFER (UNSAWN) - BOX |
|
ZSSC4175DE2BRenesas Electronics America |
WAFER (UNSAWN) - WAFER BOX |
|
MAX32664GWEA+TMaxim Integrated |
FIXED FUNCTION UC W/ BOOTLOADER |
|
ZSSC3136BE1DRenesas Electronics America |
DICE (WAFER SAWN) - WAFFLE PACK |
|
ZSSC4171BE1BRenesas Electronics America |
WAFER (UNSAWN) - BOX |
|
ZSSC3122AA1CRenesas Electronics America |
DICE (WAFER SAWN) - FRAME |
|
RM-02Rochester Electronics |
ANALOG SIGNAL CONDITIONING |
|
MAX31916AUI+Rochester Electronics |
INDUSTRIAL OCTAL DIGITAL INPUT T |
|
ZSSC4165BE1CRenesas Electronics America |
DICE (WAFER SAWN) - FRAME |
|
PMB7720HV1.4510PCCRochester Electronics |
PMB7720HV DECT IC |