CAP CER 1000PF 100V NP0 RADIAL
THERMAL PAD, SHEET 320X320MM, TH
IC SOC CORTEX-A9 667MHZ 900FCBGA
MULTI-LAYER CHIP BEAD
Type | Description |
---|---|
Series: | Zynq®-7000 |
Package: | Tray |
Part Status: | Active |
Architecture: | MCU, FPGA |
Core Processor: | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Flash Size: | - |
RAM Size: | 256KB |
Peripherals: | DMA |
Connectivity: | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: | 667MHz |
Primary Attributes: | Kintex™-7 FPGA, 444K Logic Cells |
Operating Temperature: | -40°C ~ 100°C (TJ) |
Package / Case: | 900-BBGA, FCBGA |
Supplier Device Package: | 900-FCBGA (31x31) |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
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