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XAZU3EG-1SBVA484Q

XAZU3EG-1SBVA484Q

XAZU3EG-1SBVA484Q

XAZU3EG-1SBVA484Q

XAZU3EG-1SBVA484Q

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Part No :

XAZU3EG-1SBVA484Q

Manufacturer
Xilinx
Description
XAZU3EG-1SBVA484Q
Catalog
Embedded - System On Chip (SoC)
Availability
397639 pieces
Shipped from
HK warehouse
Expected Shipping Date
Nov 14 - Nov 18 2024
Type Description
Series:Zynq® UltraScale+™ MPSoC EG
Package:Tray
Part Status:Active
Architecture:MPU, FPGA
Core Processor:Quad ARM® Cortex®-A9 MPCore™ with CoreSight™, Dual ARM® Cortex®-R5 MPCore™ with CoreSight™
Flash Size:-
RAM Size:1.8MB
Peripherals:DMA, WDT
Connectivity:CANbus, I²C, SPI, UART/USART, USB
Speed:500MHz, 1.2GHz
Primary Attributes:Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Operating Temperature:-40°C ~ 125°C (TJ)
Package / Case:484-BFBGA, FCBGA
Supplier Device Package:484-FCBGA (19x19)
XAZU3EG-1SBVA484Q is available at GangBo-ic.com, Please review product page below for detailed information, including XAZU3EG-1SBVA484Q price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for XAZU3EG-1SBVA484Q to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

GANG BO INDUSTRIAL CO., LIMITED [Hongkong]

UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK

Office Hours : Mon-Fri, 9:00-18:30(GMT+8)

[email protected]

Phone: 00852-52612101

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