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TC74ACT374P

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IC FF D-TYPE SNGL 8BIT 20DIP

UPD70F3557AM1GMA-GBK-E2-QS-AX

UPD70F3557AM1GMA-GBK-E2-QS-AX

IC MCU 32BIT 1.5MB FLSH 176HLQFP

UPD70F3557AM1GMA-GBK-E2-QS-AX

UPD70F3557AM1GMA-GBK-E2-QS-AX

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Part No :

UPD70F3557AM1GMA-GBK-E2-QS-AX

Manufacturer
Renesas Electronics America
Description
IC MCU 32BIT 1.5MB FLSH 176HLQFP
Catalog
Embedded - Microcontrollers
Availability
134713 pieces
Shipped from
HK warehouse
Expected Shipping Date
Nov 15 - Nov 19 2024
Type Description
Series:V850E2/Fx4
Package:Tray
Part Status:Obsolete
Core Processor:V850E2
Core Size:32-Bit
Speed:80MHz
Connectivity:CANbus, CSI, I²C, LINbus, UART/USART
Peripherals:DMA, PWM, WDT
Number of I/O:136
Program Memory Size:1.5MB (1.5M x 8)
Program Memory Type:FLASH
EEPROM Size:64K x 8
RAM Size:112K x 8
Voltage - Supply (Vcc/Vdd):3V ~ 5.5V
Data Converters:A/D 40x12b
Oscillator Type:Internal
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:176-LQFP Exposed Pad
Supplier Device Package:176-HLQFP (24x24)
UPD70F3557AM1GMA-GBK-E2-QS-AX is available at GangBo-ic.com, Please review product page below for detailed information, including UPD70F3557AM1GMA-GBK-E2-QS-AX price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for UPD70F3557AM1GMA-GBK-E2-QS-AX to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

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