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S1C17F57D00E200

S1C17F57D00E200

IC MCU 16BIT 32KB FLASH DIE

S1C17F57D00E200

S1C17F57D00E200

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Part No :

S1C17F57D00E200

Manufacturer
Epson
Description
IC MCU 16BIT 32KB FLASH DIE
Catalog
Embedded - Microcontrollers
Availability
752375 pieces
Shipped from
HK warehouse
Expected Shipping Date
Nov 20 - Nov 24 2024
PDF
S1C17F57D00E200 PDF
Type Description
Series:-
Package:Tape & Reel (TR)
Part Status:Obsolete
Core Processor:S1C17
Core Size:16-Bit
Speed:4.2MHz
Connectivity:I²C, IrDA, SPI, UART/USART
Peripherals:PWM, WDT
Number of I/O:29
Program Memory Size:32KB (32K x 8)
Program Memory Type:FLASH
EEPROM Size:-
RAM Size:2K x 8
Voltage - Supply (Vcc/Vdd):2V ~ 3.6V
Data Converters:-
Oscillator Type:Internal
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:Die
Supplier Device Package:-
S1C17F57D00E200 is available at GangBo-ic.com, Please review product page below for detailed information, including S1C17F57D00E200 price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for S1C17F57D00E200 to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

GANG BO INDUSTRIAL CO., LIMITED [Hongkong]

UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK

Office Hours : Mon-Fri, 9:00-18:30(GMT+8)

[email protected]

Phone: 00852-52612101

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