LPC18SXX - HIGH-PERFORMANCE, HIG
PWR XFMR LAMINATED 2.5VA TH
Type | Description |
---|---|
Series: | LPC18xx |
Package: | Bulk |
Part Status: | Active |
Core Processor: | ARM® Cortex®-M3 |
Core Size: | 32-Bit |
Speed: | 180MHz |
Connectivity: | CANbus, EBI/EMI, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART |
Peripherals: | Brown-out Detect/Reset, DMA, I²S, POR, WDT |
Number of I/O: | 49 |
Program Memory Size: | - |
Program Memory Type: | ROMless |
EEPROM Size: | - |
RAM Size: | 136K x 8 |
Voltage - Supply (Vcc/Vdd): | 2.2V ~ 3.6V |
Data Converters: | A/D 4x10b; D/A 1x10b |
Oscillator Type: | Internal |
Operating Temperature: | -40°C ~ 85°C (TA) |
Mounting Type: | Surface Mount |
Package / Case: | 180-TFBGA |
Supplier Device Package: | 180-TFBGA (12x12) |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
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