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TE0803-03-3BE11-AS

TE0803-03-3BE11-AS

MODULE SOM TE0803-03

TE0803-03-3BE11-AS

TE0803-03-3BE11-AS

Image is for reference, please contact us to get the real picture

Part No :

TE0803-03-3BE11-AS

Manufacturer
Trenz Electronic
Description
MODULE SOM TE0803-03
Catalog
Embedded - Microcontroller, Microprocessor, FPGA Modules
Availability
891189 pieces
Shipped from
HK warehouse
Expected Shipping Date
Nov 26 - Nov 30 2024
Type Description
Series:TE0803
Package:Bulk
Part Status:Active
Module/Board Type:MPU Core
Core Processor:Zynq UltraScale+ XCZU3EG-1SFVC784E
Co-Processor:-
Speed:-
Flash Size:128MB
RAM Size:2GB
Connector Type:B2B
Size / Dimension:2.05" x 2.99" (52mm x 76mm)
Operating Temperature:0°C ~ 85°C
TE0803-03-3BE11-AS is available at GangBo-ic.com, Please review product page below for detailed information, including TE0803-03-3BE11-AS price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for TE0803-03-3BE11-AS to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

GANG BO INDUSTRIAL CO., LIMITED [Hongkong]

UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK

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Phone: 00852-52612101

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