HEATSINK 50X50X12.7MM XCUT
IC FPGA 114 I/O 256FBGA
Type | Description |
---|---|
Series: | Fusion® |
Package: | Tray |
Part Status: | Active |
Number of LABs/CLBs: | - |
Number of Logic Elements/Cells: | - |
Total RAM Bits: | 36864 |
Number of I/O: | 114 |
Number of Gates: | 250000 |
Voltage - Supply: | 1.425V ~ 1.575V |
Mounting Type: | Surface Mount |
Operating Temperature: | 0°C ~ 85°C (TJ) |
Package / Case: | 256-LBGA |
Supplier Device Package: | 256-FPBGA (17x17) |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
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