CONN RCPT USB2.0 TYPEA 4P SMD RA
SLEEVE, 0.25 IN DIA X 0.5 IN W
IC FPGA 133 I/O 256FTBGA
HDC FLDG 16B
Type | Description |
---|---|
Series: | ECP3 |
Package: | Tray |
Part Status: | Active |
Number of LABs/CLBs: | 4125 |
Number of Logic Elements/Cells: | 33000 |
Total RAM Bits: | 1358848 |
Number of I/O: | 133 |
Number of Gates: | - |
Voltage - Supply: | 1.14V ~ 1.26V |
Mounting Type: | Surface Mount |
Operating Temperature: | -40°C ~ 100°C (TJ) |
Package / Case: | 256-BGA |
Supplier Device Package: | 256-FTBGA (17x17) |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
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