HEATSINK 36.83X57.6X5.84MM T766
IC FPGA 322 I/O 484UBGA
ULTRAWHITE LED DIE,5500K,200000M
Type | Description |
---|---|
Series: | Cyclone® II |
Package: | Tray |
Part Status: | Active |
Number of LABs/CLBs: | 2076 |
Number of Logic Elements/Cells: | 33216 |
Total RAM Bits: | 483840 |
Number of I/O: | 322 |
Number of Gates: | - |
Voltage - Supply: | 1.15V ~ 1.25V |
Mounting Type: | Surface Mount |
Operating Temperature: | 0°C ~ 85°C (TJ) |
Package / Case: | 484-FBGA |
Supplier Device Package: | 484-UBGA (19x19) |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
10AX090N3F45E2LGIntel |
IC FPGA 768 I/O 1932FCBGA |
|
10AX032H2F34E2SGIntel |
IC FPGA 384 I/O 1152FBGA |
|
AFS1500-1FG256KRoving Networks / Microchip Technology |
IC FPGA 119 I/O 256FBGA |
|
A42MX36-2PQG208IRoving Networks / Microchip Technology |
IC FPGA 176 I/O 208QFP |
|
ICE40LP384-CM36Lattice Semiconductor |
IC FPGA 25 I/O 36UCBGA |
|
EP3C25F256I7NIntel |
IC FPGA 156 I/O 256FBGA |
|
EP3C10E144C8Intel |
IC FPGA 94 I/O 144EQFP |
|
EP1K10FC256-1Rochester Electronics |
LOADABLE PLD, 0.4NS PBGA256 |
|
A3P030-2VQG100Roving Networks / Microchip Technology |
IC FPGA 77 I/O 100VQFP |
|
XC3S1600E-4FGG484IXilinx |
IC FPGA 376 I/O 484FBGA |
|
EP20K200CF484C7Rochester Electronics |
LOADABLE PLD, 1.48NS |
|
M2GL005S-VFG256Roving Networks / Microchip Technology |
IC FPGA 161 I/O 256FBGA |
|
10AX115S3F45I2LGIntel |
IC FPGA 624 I/O 1932FCBGA |