THERM PAD 39.7MMX26.67MM
IC DRAM 8GBIT PARALLEL 800MHZ
Type | Description |
---|---|
Series: | - |
Package: | Bulk |
Part Status: | Active |
Usage: | TO-3 |
Type: | Insulator |
Shape: | Rhombus |
Outline: | 39.70mm x 26.67mm |
Thickness: | 0.0750" (1.905mm) |
Material: | Aluminum Oxide Ceramic |
Adhesive: | - |
Backing, Carrier: | - |
Color: | - |
Thermal Resistivity: | - |
Thermal Conductivity: | - |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
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