RES SMD 590 KOHM 0.5% 1/2W 0805
IC EEPROM 512KBIT SPI 20MHZ 8DIP
THERM PAD 406.4MMX406.4MM W/ADH
GUIDE PC CARD 1594B SERIES 1=5
Type | Description |
---|---|
Series: | Tpli™ 200 |
Package: | Bulk |
Part Status: | Active |
Usage: | - |
Type: | Gap Filler Pad, Sheet |
Shape: | Square |
Outline: | 406.40mm x 406.40mm |
Thickness: | 0.0250" (0.635mm) |
Material: | Silicone Elastomer |
Adhesive: | Adhesive - One Side |
Backing, Carrier: | - |
Color: | Blue |
Thermal Resistivity: | - |
Thermal Conductivity: | 6.0W/m-K |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
30MM-25.4MM-25-5590H-053M |
THERM PAD 30MMX25.4MM 1=25/PK |
|
TI900-144.4-38-0.12-0t-Global Technology |
THERM PAD 144.4MMX38MM WHITE |
|
A17820-20Laird - Performance Materials |
TFLEX HD95000,DC1 |
|
A16366-03Laird - Performance Materials |
THERM PAD 431.8MMX457.2MM PINK |
|
SPK10-0.006-00-48Henkel / Bergquist |
THERM PAD 25.4MMX25.4MM BEIGE |
|
A14417-01Laird - Performance Materials |
THERM PAD 228.6X228.6MM BLU/VIO |
|
A10098-02Laird - Performance Materials |
THERM PAD 203.2MMX203.2MM W/ADH |
|
A16106-12Laird - Performance Materials |
THERM PAD 228.6MMX228.6MM GRAY |
|
21.59MM-25.4MM-25-88153M |
THERM PAD 25.4MMX21.59MM 1=25/PK |
|
53-77-5GAavid |
HEATSINK |
|
A16366-42Laird - Performance Materials |
THERM PAD 457.2MMX457.2MM PINK |
|
1009-60Henkel / Bergquist |
THERM PAD 11.1MMX7.92MM PINK |
|
SP400-0.007-00-17Henkel / Bergquist |
THERM PAD 41.91MMX28.96MM GRAY |