THERM PAD 36.83MMX21.29MM W/ADH
CBL ASSEMBLY 3POS M TO WIRE 1M
CBL ASSEMBLY 5POS F TO WIRE 2M
IC MCU 32BIT 800KB FLASH 100LQFP
Type | Description |
---|---|
Series: | Hi-Flow® 115-AC |
Package: | Bulk |
Part Status: | Active |
Usage: | SIP |
Type: | Pad, Sheet |
Shape: | Rectangular |
Outline: | 36.83mm x 21.29mm |
Thickness: | 0.0055" (0.140mm) |
Material: | Phase Change Compound |
Adhesive: | Adhesive - One Side |
Backing, Carrier: | Fiberglass |
Color: | Gray |
Thermal Resistivity: | 0.35°C/W |
Thermal Conductivity: | 0.8W/m-K |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
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