THERM PAD 18.03MMX12.7MM W/ADH
IC PSRAM 16MBIT PARALLEL 48TFBGA
Type | Description |
---|---|
Series: | Ti900 |
Package: | Bulk |
Part Status: | Active |
Usage: | TO-220 |
Type: | Die-Cut Pad, Sheet |
Shape: | Rectangular |
Outline: | 18.03mm x 12.70mm |
Thickness: | 0.0050" (0.127mm) |
Material: | Silicone |
Adhesive: | Adhesive - Both Sides |
Backing, Carrier: | Viscose |
Color: | White |
Thermal Resistivity: | - |
Thermal Conductivity: | 1.8W/m-K |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
1/2-5-88053M |
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