IC EEPROM 1KBIT I2C 1MHZ 8SOIC
PWR XFMR LAMINATED 1000VA CHAS
BOX PLSTC GRAY/CLR 5.2"LX11.81"W
HEATSINK FORGED WITH SMALL CLIP
Type | Description |
---|---|
Series: | APR |
Package: | Box |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Clip |
Shape: | Square, Pin Fins |
Length: | 1.047" (26.60mm) |
Width: | 1.047" (26.60mm) |
Diameter: | - |
Fin Height: | 0.457" (11.60mm) |
Power Dissipation @ Temperature Rise: | - |
Thermal Resistance @ Forced Air Flow: | 5.30°C/W @ 200 LFM |
Thermal Resistance @ Natural: | - |
Material: | Aluminum |
Material Finish: | Black Anodized |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
RUR671UCTS Corporation |
HEATSINK PRESSON PANEL MNT TO-92 |
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1-1963552-2TE Connectivity AMP Connectors |
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2-1963555-5TE Connectivity AMP Connectors |
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8-1542003-4TE Connectivity AMP Connectors |
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