HEATSINK 40X40X25MM R-TAB T766
Type | Description |
---|---|
Series: | pushPIN™ |
Package: | Tray |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.575" (40.00mm) |
Width: | 1.575" (40.00mm) |
Diameter: | - |
Fin Height: | 0.984" (25.00mm) |
Power Dissipation @ Temperature Rise: | - |
Thermal Resistance @ Forced Air Flow: | 9.39°C/W @ 100 LFM |
Thermal Resistance @ Natural: | - |
Material: | Aluminum |
Material Finish: | Blue Anodized |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
ATS-55325K-C0-R0Advanced Thermal Solutions, Inc. |
HEATSINK 32.5X32.5X14.5MM NO TIM |
|
ATS-52325P-C0-R0Advanced Thermal Solutions, Inc. |
HEATSINK 32.5X32.5X17.5MM NO TIM |
|
HSET976-AiBASE Technology |
HEATSINK WITH COOLER FOR ET976 |
|
1542615-2TE Connectivity AMP Connectors |
HS PLTD |
|
ATS-EXL117-1220-R0Advanced Thermal Solutions, Inc. |
PCIE EXTRUSION PROFILE, AL6063 |
|
ATS-10E-116-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM XCUT T766 |
|
ATS-04H-116-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM XCUT T766 |
|
ATS-11B-184-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
|
642-35ABT4EWakefield-Vette |
HEATSINK FOR 35MM BGA |
|
ATS-04G-116-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM XCUT T766 |
|
ATS-03B-156-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
|
TGH-0200-03t-Global Technology |
ALUMINIUM HEAT SINK 20X20MM |
|
ATS-18E-05-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM XCUT T766 |