HEATSINK 40X40X25MM L-TAB T766
Type | Description |
---|---|
Series: | pushPIN™ |
Package: | Tray |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.575" (40.00mm) |
Width: | 1.575" (40.00mm) |
Diameter: | - |
Fin Height: | 0.984" (25.00mm) |
Power Dissipation @ Temperature Rise: | - |
Thermal Resistance @ Forced Air Flow: | 9.39°C/W @ 100 LFM |
Thermal Resistance @ Natural: | - |
Material: | Aluminum |
Material Finish: | Blue Anodized |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
![]() |
ATS-17E-156-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
![]() |
ATS-19G-94-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
![]() |
ATS-10B-116-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM XCUT T766 |
![]() |
625-60ABT1EWakefield-Vette |
HEATSINK FOR 25MM BGA |
![]() |
ATS-05F-64-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
![]() |
658-45ABT1EWakefield-Vette |
HEATSINK CPU 28MM SQBLK W/O TAPE |
![]() |
HSET975-1iBASE Technology |
HEAT SPREADER FOR ET975 (H051HSE |
![]() |
657-25ABPESCWakefield-Vette |
HEATSINK TO-220 W/PINS BLK 2.5" |
![]() |
40533Vicor |
BOM ASSY 6123 XF PUSHPIN HTSNK |
![]() |
39880100050Emerson Embedded Power (Artesyn Embedded Technologies) |
HEATSINK 1/4 BRICK VERT |
![]() |
39880100090Emerson Embedded Power (Artesyn Embedded Technologies) |
HEATSINK 1/2 BRICK VERT |
![]() |
523002D00000GAavid |
BOARD LEVEL HEAT SINK |
![]() |
132-10BWakefield-Vette |
HEATSINK EXTRUDED |